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The Hong Kong Monetary Authority (HKMA), as representative of the Hong Kong Special Administrative Region Government (HKSAR Government), announced today (7 February) that a tender of 10-year RMB Government Bonds (Bonds) through the re-opening of existing 10-year Government Bond issue 10GB3411001 under the Infrastructure Bond Programme will be held on Thursday, 13 February 2025, for settlement on Monday, 17 February 2025.

An additional amount of RMB1. 0 billion of the outstanding 10-year Bonds (issue no. 10GB3411001) will be on offer. The Bonds will mature on 20 November 2034 and will carry interest at the rate of 2. 46% per annum payable semi-annually in arrear. The Indicative Pricings of the Bonds on 7 February 2025 are 100. 47 with a semi-annualised yield of 2. 406%.

Tender is open only to Primary Dealers appointed under the Infrastructure Bond Programme. Anyone wishing to apply for the Bonds on offer can do so through any of the Primary Dealers on the latest published list, which can be obtained from the Hong Kong Government Bonds website at https://www. hkgb. gov. hk. Each tender must be for an amount of RMB50,000 or integral multiples thereof.

Tender results will be published on the HKMA’s website, the Hong Kong Government Bonds website, Bloomberg (GBHK ) and Refinitiv (IBPGSBPINDEX). The publication time is expected to be no later than 3:00 pm on the tender day.

Hong Kong Monetary Authority 7 February 2025

HKSAR INSTITUTIONAL GOVERNMENT BONDS TENDER INFORMATION

Tender information of re-opening of 10-year RMB HKSAR Institutional Government Bonds:-

Issue Number

:

10GB3411001

Stock Code

:

84586 (HKGB2. 46 3411-R)

Tender Date and Time

:

Thursday, 13 February 2025

9:30 am to 10:30 am

Issue and Settlement Date

:

Monday, 17 February 2025

Amount on Offer

:

RMB1. 0 billion

Maturity              

:

10 years

Remaining maturity

:

Approximately 9. 76 years

Maturity Date

:

Monday, 20 November 2034

Interest Rate    

:

2. 46% p. a. payable semi-annually in arrear

Interest Payment Dates 

:

18 May and 18 November in each year, commencing on the Issue Date up to and including the Maturity Date, subject to adjustment in accordance with the terms of the Institutional Issuances Information Memorandum of the Infrastructure Bond Programme and Government Sustainable Bond Programme (Information Memorandum) published on the Hong Kong Government Bonds website.

Method of Tender

:

Competitive tender

Tender Amount

:

Each competitive tender must be for an amount of RMB50,000 or integral multiples thereof. Any tender applications for the Bonds must be submitted through a Primary Dealer on the latest published list.

The accrued interest to be paid by successful bidders on the issue date (17 February 2025) for the tender amount is RMB306. 66 per minimum denomination of RMB50,000.

(The accrued interest to be paid for tender amount exceeding RMB50,000 may not be exactly equal to the figures calculated from the accrued interest per minimum denomination of RMB50,000 due to rounding).

Other Details 

:

Please see Information Memorandum available on the Hong Kong Government Bonds website or approach Primary Dealers.

Expected commencement date of dealing on the Stock Exchange of Hong Kong Limited

:

The tender amount is fully fungible with the existing 10GB3411001 (Stock code: 84586) listed on the Stock Exchange of Hong Kong.

Use of Proceeds

:

The Bonds will be issued under the institutional part of the Infrastructure Bond Programme. Proceeds will be invested in infrastructure projects in accordance with the Infrastructure Bond Framework published on the Hong Kong Government Bonds website. Hong Kong Monetary Authority 7 February 2025