HKMA launches Digital Bond Grant Scheme
The Hong Kong Monetary Authority (HKMA) launched today (28 November)
the Digital Bond Grant Scheme (DBGS), which was announced in the 2024
Policy Address.
The DBGS aims to promote the development of
the digital securities market and encourage broader adoption of
tokenisation technology in capital market transactions. Subject to the
satisfaction of relevant eligibility requirements under the DBGS, a
maximum grant of HK$2. 5 million will be offered to each eligible
digital bond issuance in Hong Kong.
Following industry
consultation, the HKMA has set out the details of the DBGS in the
Guideline on the Digital Bond Grant Scheme. The DBGS will start
accepting applications today, with an initial period of three years.
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Hong Kong Monetary Authority 28 November 2024